Developing Environmental Sensor Networks at the SSU Preserves: Opportunities for Cross-Disciplinary Collaboration
Dr. Claudia Luke
Director of Field Stations and Nature Preserves
SSU
Thu, 10/17/2013
Abstract – Advances in sensor, communication, and computing technology are transforming understanding of environmental processes on a global scale. Despite the promise that new cyber-technologies hold, much more research and training are needed to advance this new field. Unfortunately, student access to networks needed for real-world experiences is typically limited at undergraduate institutions. The SSU Preserves is working with Farid Farahmand and other faculty in SSU’s Engineering Science Department to construct a wireless sensor network at the Fairfield Osborn Preserve. The project builds on existing senior capstone projects and Master’s degrees to create a small high-speed wireless network that: (a) Collects and transmits sensor data that can be used by classes on campus, (b) Interfaces with sensors and software designed by engineering and computer science students, (c) Introduces students in other disciplines to fundamentals of engineering, instrumentation, and measurements needed for a technologically literate society, (d) Creates opportunities for professional employment experiences for Engineering Science students.
Dr. Claudia Luke, Director of SSU Preserves, earned her Ph.D. in Zoology at UC Berkeley. She has 20 years of experience directing 6 university field stations for the University of California and California State University systems. She has worked extensively with partners and collaborators to build regional research, management, and education collaborations in the areas of watershed management, fire management, habitat connectivity, and habitat enhancement. As Reserve Director for San Diego State University, she supported the development and use of a 4,000-acre wireless sensor network, which included obtaining a $1.2 million collaborative grant to explore the efficacy of fire sensors in enhancing community safety.
High Frequency Design On PCB
Mr. Tamir Moran
Principal Hardware Engineer
National Instruments
Thu, 10/03/2013
Abstract – The growing consumer wireless market continues to demand ever increasing performance at lower cost, shorter design cycles, and smaller size that challenge engineers in ways never seen before. To enable this fast growth of wireless devices, Test & measurement (T&M) companies must stay ahead of the technology deployment curve and routinely deliver high performance test solutions at compelling price points. Previously, RF/Microwave design relied on long prototyping cycles, exotic materials and sophisticated processes that were unsuitable for meeting aggressive design cycles and cost goals. Modern RF Engineers depend on improved modeling techniques, simulation tools like AWR, off the shelf components, and wellknown, cost effective manufacturing processes to meet the timeframe and high volume demands of component vendors. In the last decade, The availability of RFICs in surface mount (SMT) packages and high volume, high frequency PCB technologies have emerged to allow engineers to meet market demands for performance, cost and schedule. This presentation will discuss a design cycle that combines highly advanced simulations available in AWR with the latest PCB process to show RF/Microwave engineers a new methodology to meet their performance, cost and schedule goals.
Mr. Tamir Moran received his BSEE and MSEE in 1997 and 1999, respectively, from the University of Arizona, Tucson. In 1999 he joined Agilent Technologies as a design engineer in the Network Analysis Division, Santa Rosa, CA, where he designed high frequency circuits on PCB and hybrid circuit technologies. Since 2006 he has been with National Instrument’s R&D center in Santa Rosa, CA working as a Principal RF Engineer developing RF/Microwave PXI modules for the Test & Measurement Industry, and responsible for developing advanced technologies.
Design and Testing Challenges of Consumer Devices in High Volume Manufacturing
Mr. Bela Szendrenyi
Senior R&D Design Consultant
Advantest America Inc.
Thu, 09/19/2013
Abstract – Ever wondered how can be cell phones and other electronic gadgets produced so inexpensively that service providers are giving those away for just about a few Dollars? One example is a recent iPhone3 deal for 99 cents… Even if some cost is recovered with monthly locked-in fees, production cost is counted barely 18-23% of actual consumer price. So how are these complicated Silicon chips manufactured and fully tested for under a Dollar? Ever increasing system requirements and mushrooming number of cell channels in USA, Japan, and Europe – require 25-30 different type, altogether few hundred actual measurements done during production of these devices. Consumer expectation is that these phones are fully tested, and all functions work properly. In this presentation we are going to take a quick look at every step of the challenge: automated test system, handler interface, on-wafer measurements, DUT board design, high frequency signal and power integrity! Come and take part of the technical journey the practicing engineer needs to cover in production of these tools of our everyday life.
Mr. Bela Szendrenyi is a lead contributor of the development team in the Test Cell Innovation Group at Advantest America, Inc. He has an MSEE in Telecommunications from the Technical University of Budapest, Hungary. In 1984 Bela joined the Research Institute of Technical Physics for the Hungarian Academy of Sciences where he participated in the high frequency GaAs device development as a Research Fellow. In 1991 he moved to Canada, then few years later to California, where he worked for Gigahertz Technologies, Maury Microwave Inc., Agilent Technologies, and Verigy Inc. companies on various high frequency and high speed programs. Bela and wife, Gyongyi, have two university-age kids and they all live in Santa Rosa. In his free time he likes various sport and outdoor activities, with family.
Breakthrough Precision in RF and Microwave Field Measurements
Mr. Steve Westerman
Handheld Products R&D Project Manager
Agilent Technologies
Thu, 09/05/2013
Abstract –Agilent Technologies has developed a new handheld instrument, the Microwave FieldFox, powered by integrated circuits designed at the High Frequency Technology Center in Santa Rosa. This versatile tool delivers laboratory-grade measurement capabilities to 26.5GHz, combining a full 2-port Vector Network Analyzer, Spectrum Analyzer, Independent Source, Power Meter, Cable Antenna Tester, Vector Voltmeter, DC Supply, and much more in a portable, 6-pound package that is fieldrugged and battery-operated. Before the advent of this instrumentation technology, this measurement breadth and capability required a 300-pound rack of instruments. Come and hear the FieldFox story, and see a demonstration of its capabilities.
Mr. Steve Westerman manages hardware research and development for the FieldFox Handheld Analyzer organization at Agilent Technologies, Inc., in the Component Test Division (CTD). Steve earned his BSEE from Washington State University and MSEE from Stanford University, and joined Hewlett-Packard in 1982 as a production engineer in the Signal Analysis Division. He moved to the R&D department in 1990, where he designed highfrequency microcircuits and printed circuit assemblies for Spectrum and Network Analyzers. His chief areas of contribution are front ends, samplers, amplifiers, Yttrium-Iron-Garnet (YIG) systems, phased-locked loops, and frequency references. He holds 4 patents and 1 defensive publication. In his spare time he enjoys gardening with wife Heidi, foreign travel and language study, and playing the piano.
Overview of Digital IC Design
Mr. Ryan Hirth
Technical Director
Broadcom
Thu, 04/18/2013
Abstract – An introduction into large scale digital IC design practices. This lecture will cover basic practices used to improve coding quality and design partitioning. An overview of various FIFOs, arbiters, and clock boundaries will be covered. The lecture will cover common rules-of-thumb practices to improve timing closure, verification, and testability of digital ICs.
Mr. Ryan Hirth is a Technical Director for Ethernet Access products at Broadcom. He is responsible for architecture and development of Ethernet Passive Optical Network (EPON) integrated circuits. Ryan was the Director of IC Engineer at Teknovus before the Broadcom acquisition in 2010. Ryan has developed over fifteen PON ICs. He has been a key technical contributor to the IEEE 802.3ah (1G-EPON), IEEE 802.3av (10G-EPON), and IEEE1904.1 (SIEPON) standards. Prior to Teknovus, he was ASIC Director at Terawave developing BPON ICs. He also held design engineering positions at Advanced Fibre Communication and 3Com. Ryan has B.S. in Electronic Engineering from California Polytechnic University, San Luis Obispo. Ryan has been granted 11 U.S. patents.