High Frequency Design On PCB

Mr. Tamir Moran
Principal Hardware Engineer National Instruments

Cerent Engineering Science Complex, Salazar Hall 2009A
4:00 PM

Abstract – The growing consumer wireless market continues to demand ever increasing performance at lower cost, shorter design cycles, and smaller size that challenge engineers in ways never seen before. To enable this fast growth of wireless devices, Test & measurement (T&M) companies must stay ahead of the technology deployment curve and routinely deliver high performance test solutions at compelling price points. Previously, RF/Microwave design relied on long prototyping cycles, exotic materials and sophisticated processes that were unsuitable for meeting aggressive design cycles and cost goals. Modern RF Engineers depend on improved modeling techniques, simulation tools like AWR, off the shelf components, and wellknown, cost effective manufacturing processes to meet the timeframe and high volume demands of component vendors. In the last decade, The availability of RFICs in surface mount (SMT) packages and high volume, high frequency PCB technologies have emerged to allow engineers to meet market demands for performance, cost and schedule. This presentation will discuss a design cycle that combines highly advanced simulations available in AWR with the latest PCB process to show RF/Microwave engineers a new methodology to meet their performance, cost and schedule goals.

Mr. Tamir Moran received his BSEE and MSEE in 1997 and 1999, respectively, from the University of Arizona, Tucson. In 1999 he joined Agilent Technologies as a design engineer in the Network Analysis Division, Santa Rosa, CA, where he designed high frequency circuits on PCB and hybrid circuit technologies. Since 2006 he has been with National Instrument’s R&D center in Santa Rosa, CA working as a Principal RF Engineer developing RF/Microwave PXI modules for the Test & Measurement Industry, and responsible for developing advanced technologies.