Analyzing and Avoiding Failures in Electronics and Life

Ms. Julie Silk
Environmental Compliance Program Manager EMG Customer Experience and Quality, Agilent Technologies

Cerent Engineering Science Complex, Salazar Hall 2009A
3:00 PM

Abstract – Customer expectations for lifetimes of electronic products vary with the type of equipment, with cell phones that could last less than 3 years to expensive high technology equipment that is expected to last over a decade. The lifetime of electronic equipment is often dependent on the reliability of the printed circuit assemblies that contribute much of the function of the product. These assemblies have increased in complexity as more and more performance is added in smaller and smaller packages. With the European Union directive on the Restriction of Hazardous Substances, higher melting point lead-free solder is used, resulting in added material challenges and failure mechanisms. This lecture will provide understanding of basic printed circuit board construction, printed circuit assembly processes and the materials used. Failure analysis techniques and the metallurgy of solder joints will be described. A variety of printed circuit failures are used to illustrate the failure mechanisms, the design rules or process requirements that avoid these failures, and a few life lessons.

Ms. Julie Silk is the Environmental Compliance Program Manager for the Electronic Measurements Group of Agilent Technologies. She has had a focus on printed circuit assembly design, quality, reliability and supplier development. She has a BS in Chemical Engineering from the University of Washington and has worked for Hewlett-Packard and Agilent Technologies for over 30 years. A recent graduate of Leadership Santa Rosa, she also is dedicated to encouraging young women to enter engineering fields through Agilent’s Introduce a Girl to Engineering Day and as president of the non-profit Expanding Your Horizons Sonoma County.